Eagle board design (first time): soliciting review by experts...

[msjfb]

Hi,
I am a complete newb with Eagle, and I finally have a prototyping board for Moteino design made up I wish to submit to OSH Park. But I thought I would reach out to the experts to check it out before I submit it.
After building a couple of projects on strip-boards I found it terribly time consuming, so I decided to design a general purpose board (2in x 4in) that would hold a Moteino, a coupe of relays, a IC based H-Bridge, leds, connectors for sensors,etc. This is based on my projected needs and parts inventory.

So I am supplying the Eagle files and any comments would be greatly appreciated. In any case feel free to use it as you wish (credit goes to TomWS for the Moteino library).

I used the OSHPark DRU file ,and all looks OK after Autorouting except for a series of  errors that seem related to the silkscreen information included in some of the components. My understanding is that this would NOT prevent production.

I will probably fatten up the traces on the relay outputs,  just in case I need to switch a bit more power.

Thanks,

François

[Felix]

Your traces are way too thin - just 6mil - and in some places they are very close to each other.
I would suggest going at least 10mil and 10mil trace separation. Run a Design Rule Check (DRC) on your board before you submit it.
Also fill your board with a copper pour, that should be either GND or VCC.
You should ensure your parts will fit the footprints before you make the boards. The USB connector looks unconventional to me.
I cannot comment on the layout of the components/headers, that's up to you.

[msjfb]

Thanks for your comments and the heads up, Felix.
Enclosed is the final look... (12 mil trace and separation, ground pour, some manual rerouting).
FWI the USB connector is Molex part #548190519 from Digikey. I double checked to make sure it fits.

Thinking of going with Accutrace for production. Will post here for feedback on how it turns out.

François

[Felix]

Much better. Another suggestion: keep thermal reliefs thin and remove some of them. For some pads there can be up to 8 or 10 reliefs which will dissipate the heat of the solder iron and make it a big pain to solder anything, especially if you don't have a really good iron.
You can keep 1-2 reliefs on each side, draw rectangles on the trestrict/brestrict layers. Also you can thin them by adjusting the width of your fill rectangle (right click on the edge to get properties and set width to 6-8 mil).