I only use my method when I have the occasional SMT component to mount, eg a 'tuned' component or a board which only has a few SMT parts. If I had 'many boards' or 'several SMT components', I'll use a stencil, paste, and my handy dandy reflow 'toaster' oven, which, over time, has become a reliable means to make boards with components down to 0.5mm pitch (eg AM18x5 RTC and various DOF sensors).
Tom